Key opportunities include the growth of high-performance computing, automotive electronics, and IoT applications 3D ...

What’s 3D IC, and what’s causing the shift from 2D IC to 3D IC? How does this new technology relate to heterogeneous integration and advanced packaging? What is required for a successful 3D IC ...

2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...

LAS VEGAS, NV, UNITED STATES, January 20, 2026 / EINPresswire.com / — CIT (CEO Seung Jeong) announced its participation in ...

MOUNTAIN VIEW, Calif.--(BUSINESS WIRE)--Lightmatter, the leader in photonic supercomputing, today announced a strategic partnership with Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of ...

Ansys Redhawk-SC™ and Ansys Redhawk-SC Electrothermal™ have been certified by United Microelectronics Corporation (UMC) to simulate its latest 3D integrated circuit (3D-IC) packaging technology Chip ...

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

A cornerstone of effective STCO is the ability to conduct multi-domain analyses—for example, signal integrity, power ...

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...

The Industrial Technology Research Institute (ITRI) has partnered with microcontroller unit (MCU) manufacturer Generalplus to develop a wireless oral sensing capsule for medical inspection services.

Paras Defence launched Paras Semiconductor to set up advanced heterogeneous & 3D chip packaging, strengthening India’s ...