SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced a new lineup of flip chip LED packages and modules offering ...

SEOUL, South Korea, Jan. 18, 2018 /PRNewswire/ -- LG Innotek today announced that it had succeeded in developing an 'advanced flip chip LED package' that demonstrates high efficiency and high luminous ...

BROOKINGS, S.D., May 16, 2024 (GLOBE NEWSWIRE) -- Daktronics (DAKT) (NASDAQ-DAKT) of Brookings, South Dakota, has released its Flip-Chip COB (Chip On Board) LED display technology worldwide. The ...

Advanced semiconductor packaging requirements for higher and faster performance in a thinner and smaller form factor continues to grow for mobile, network and consumer devices. While the increase in ...

Harvatek Corporation has introduced a new LED product in chip scale package (CSP). This LED has high brightness with low power dissipation and there are no wire bonding which reduces the processing ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, has introduced new chip-on-board (COB) LED package lineups, including small LES ...

YOUNGIN-SI, South Korea, Nov. 11, 2020 /PRNewswire/ -- Semicon Light plans to actively respond to the patents to protect the original technology, "Silver- Free Flip Chip LED". Semicon Light, a company ...

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