No matter what, it's clear at this point that the way forward for the semiconductor industry is chiplets, or "tiles" in Intel nomenclature. Piling multiple pieces of a processor onto one package ...

SPHBM4 cuts pin counts dramatically while preserving hyperscale-class bandwidth performanceOrganic substrates reduce packaging costs and relax routing constraints in HBM designsSerialization shifts ...

Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...

Glass substrates could be the key to linking up massive multi-chiplet processors of the near(ish) future. When you purchase through links on our site, we may earn an affiliate commission. Here’s how ...

Oxidative functionalization of hydrophobic compounds is an important research area from the perspective of effective utilization of natural resources and treatment and reuse of hazardous substances.

Advanced IC substrates (AICS) have been marching toward the 2µm line/space (L/S) redistribution layer (RDL) technology node for some time (figure 1). However, many questions remain about the ability ...

The big picture: Most expect that by the end of the decade, the semiconductor industry will hit a wall in terms of being able to scale transistors on silicon using organic materials. Scaling is key to ...

Recently, the research team of Tierui Zhang from the Institute of Chemistry and Physics, Chinese Academy of Sciences, published a Mini-Review titled "Innovative and Sustainable Approaches to Aerobic ...