The Global FOUP Load Port market is anticipated to rise at a considerable rate during the forecast period, between 2023 and 2030. In 2022, the market is growing at a steady rate and with the rising ...
CHIBA, Japan–During the Semicon Japan trade show here today, Asyst Technologies Inc. announced a new lightweight front-opening unified pod (FOUP) for 300-mm wafers and a new SMIF-300FL front-load port ...
FREMONT, Calif.–Asyst Technologies Inc. today unveiled its next-generation 300-mm load port product, which the company said breaks new ground in automated wafer handling for front-opening-unified-pod ...
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