Interdiffusion modelling in alloy systems seeks to predict how distinct metallic species migrate and redistribute under thermal and chemical driving forces. By coupling thermodynamic descriptions with ...
Abstract: SiC chip and a direct bonding copper (DBC) substrate with electroless nickel/immersion gold (ENIG) surface were bonded by nano-Ag paste. Interdiffusion occurred between these Ag ...
Abstract: This paper proposes a “dry” laser-sintering method and discusses characteristics of a laser-sintered silver thin film on a polyimide or a copper substrate. This novel technology consists of ...
x, 578 pages : 24 cm ...
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