On May 25, He Tingbo, president of Huawei’s semiconductor business department, published a paper on ChinaXiv detailing the newly proposed “Tau (τ) Scaling Law” and parts of the roadmap for Huawei’s Kirin and Ascend chips. “Keep moving forward, a bridge and way will emerge,” He Tingbo recently spoke with the People's Daily about Huawei’s chip progress and its new semiconductor design approach.

With HUAWEI Kirin 2026 launching later this year, HUAWEI’s He Tingbo showcases the big leap ahead for semiconductors supported by LogicFolding.

It's been a long journey — 6 years and 381 chips to be exact — but HUAWEI's He Tingbo explains how HUAWEI's high-end chips are now expected to feature a transistor density that is equivalent to 14 Å (1.4 nm) processes by 2031.